Technology to build our wireless future
We push boundaries through innovative design, manufacturing and integration, starting with the fundamental building blocks of any RF system: passive components and packaging.
THE ACTIVE-PASSIVE DIVIDE
Any RF system can be broken down into two essential types of component: actives and passives. Actives are the power players, creating, amplifying, and modulating RF signals. Passives are the backbone, used to create antennas, filters, couplers, and transmission lines — everything needed to make a device truly wireless.
Ideally we would integrate active and passive components in a single technology and use that for everything. There’s just one problem: cutting-edge semiconductor tech comes at steep prices with high RF losses, making it tough to blend in passive elements. This stands in the way of the standard system-on-chip (SoC) designs ruling today’s wireless scene.
We have chips capable of propelling us to 100 GHz and beyond, laying the groundwork for our wireless future. The missing piece is a scalable approach to constructing RF systems that effectively harness the power of these chips.
SoC is DEAD. Long live SiP.
Our solution to this fundamental problem is simple: split the actives and passives into different technologies and adopt system-in-package (SiP) architectures. By moving functionality from the chip to a high-performance package we can create systems that beat SoC’s on several fronts:
- Improved RF, mechanical and thermal performance
- Higher efficiency through reduced RF loss
- Lower cost, as the chips can be made simpler
The outcome? A sleek, seamlessly integrated system that outshines SoCs in performance and price.
This concept isn’t groundbreaking, but our packaging technology is. That’s our secret to crafting systems that genuinely excel.
Looking Backwards to Go Forwards
In the past, generating RF signals was a challenging task, demanding systems that utilized every milliwatt of power. As technology advanced, producing high-power RF signals became simpler, and the stringent need for efficiency diminished with the abundance of power.
The development of 5G/mm-wave and the impending shift to 6G and sub-THz have reignited the importance of efficiency. In an era where transistors yield only microwatts of power, optimizing the efficiency of our RF systems has become crucial once again.
We’re turning back to the fundamental principles, where RF power is treated as a valued asset. Our focus is on pioneering a new wave of packaging technology that prioritizes maximum efficiency, ensuring our RF systems are primed for tomorrow’s demands.
TERASi Technology Platform
At TERASi, we leverage advanced technologies to develop state-of-the-art hardware for the wireless, semiconductor, and space industries. Our innovative solutions are designed to outperform the competition and meet the evolving needs of our clients.
Maximum Performance, Minimum Footprint
Precision manufacturing, high quality materials and refined design combine to make our products extremely efficient, compact and lightweight.
Seamless Integration and Compatibility
Our hardware seamlessly integrates with conventional RF systems, ensuring compatibility and ease of use.
Stable. Robust. Reliable.
Semicondcuctor grade materials to ensure our products are mechanically, thermally and temporally robust.
Flexible and Scalable
TERASi’s hardware solutions are designed to be flexible and scalable, adapting to varying needs and applications.
Our secret? Bringing back air.
At the heart of our innovation lies a straightforward yet profound realization: air is an excellent dielectric medium. Why fill your transmission lines with something else when you don’t have to?
We cut out all dielectric materials, lossy substrates and leaky connections to make our components as efficient as possible.
Increase
in efficiency against conventional RF PCB substrate materials.
Reduction
in size and weight versus traditional rectangular waveguides.
Discover our Cutting-Edge Products
We offer high-performance solutions for the wireless, semiconductor, and space industries.