HARDWARE FOR OUR WIRELESS FUTURE
We develop hardware solutions that offer best-in-class performance, size and weight by combining scalable manufacturing and cutting-edge design techniques.
RF Packaging, But Not as You Know It.
Our groundbreaking system-in-package (SiP) technology merges ultra-low loss, pinpoint precision, and featherlight design into one powerhouse solution.
This innovation enables us to engineer RF systems that deliver an unmatched combination of compactness, lightness, and high performance – redefining the future of wireless technology and outperforming conventional SoCs.
THE ONLY WAY IS UP
Wireless networks are driven by one constant: an endless need for more. More data, more users, more applications. The best way to solve these demands is to add bandwidth by moving to higher frequencies.
Today’s 5G/mm-wave will not be enough. We need to go higher in frequency than ever before to get enough bandwidth to meet our future demand.
The next generation of wireless – 6G – will push us to 100 GHz and beyond, into the sub-THz spectrum. We have the chips needed to get us there. But we have no way of building low-cost, efficient RF systems at these frequencies.
Until now.
NEW PACKAGING,NEW POSSIBILITIES
Advances in semiconductor technology over the past century have given us transistors that can operate far beyond 100 GHz, allowing us to build active circuits such as amplifiers, mixers and oscillators. But there is no way to build efficient, cost-effective passives in these technologies.
We need a different approach to building complete systems which merges these two disparate technologies. We believe our system-in-package (SiP) technology is the answer.
Cutting edge components for next gen wireless
We offer a range of standard components based on our proprietary technology for use in telecoms, radar and satellite applications.
Need a custom solution? Contact us to learn more.
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